|
PCB
Fabrication Capabilities ( continued )
|
|
1 3.
|
gold
finger plating thickness
|
| |
nickel
thickness |
50
-- 400 u"(micoinch) |
| gold
thickness |
5
-- 70 u" |
|
14.
|
bare
board testing
|
| |
max.testing
panel size |
23"
X 24" |
|
15.
|
special
mechanical processing |
| |
G/F
Chamfer |
|
G/F chamfer
angle |
20°、30°、45°、60° |
| G/F angular
tolerance |
±5° |
| G/F depth
tolerance |
±5mil(L≤56mil); ±8mil(L＞56mil) |
| G/F chamfer remained thickness |
±10mil |
| “V”CUT |
| depth
tolerance |
±
2MIL |
| positioning
tolerance |
±
4MIL |
|
1 6.
|
D/S
and M/L twist and warp
<
0.7% |
|
1 7.
|
laser
photo plotter system
|
| |
max.plot.area. |
24"
X 24" |
| accuracy |
4000/8000
line |
| repeatability |
0.0127mm |
|
1 8. |
CAM
system
|
PLAN-MASTER-I,
OBOTEK
Genesis2K |
|
19.
|
insulation
resistance
|
10Ω
NORMAL |
|
2 0.
|
through
hole resistance
|
<300μΩ
NORMAL |
|
2 1.
|
dielectric
resistance
|
>1.3KV/MM
NORMAL |
|
2 2.
|
current
breakdown
|
10A
|
|
2 3.
|
peel
strength
|
>1.4N/MM
|
|
2 4.
|
so lder
mask abrasion
|
>6H
|
|
2 5.
|
thermal
stress
|
288±5°C ,
10+1/-0 SEC
|
|
2 6.
|
flammability
|
94-VO
|