|
PCB
Fabrication Capabilities
|
|
1.
|
Products
type
|
sigle-sided(S/S),
double-sided(D/S), multilayer(M/L) (up to 22 layers)
|
|
2.
|
Base
material
|
S/S:
FR-1, CEM-1 or as required
|
| D/S:
FR-4, CEM-3, PTE1 or as required |
| M/L:
FR-4 or as required |
|
3.
|
Finished
board size
|
|
S/S,D/S,M/L
MAX |
23"
X 24" |
|
4.
|
Finished
hole dia.
|
|
min.p.t.h.dia |
4MIL |
|
5.
|
conductor
width & space
|
|
min.width |
4MIL |
| min.space |
4MIL |
|
6.
|
solder
mask options
|
|
liquid
photo imageable soder mask |
TAUTI
OSR-4000 |
| TAMURA
DSR2200 |
| thermal
cure solder mask |
TAIYO
S-502 |
| colour |
green,
yellow |
|
7.
|
legend
printing
|
thermal
cure or uv
|
|
colour |
white,
black |
| min.legend
width |
3MIL |
|
8.
|
plating
thickness
|
|
hole
wall copper plating thickness |
| average |
1.0MIL |
| min |
0.8MIL |
| 9. |
finished
surface |
HAL,
Ni-Au, ENTEK, flux |
| 10. |
Sn
thickness ( H. A. L. ) |
|
min. |
0.03MIL |
| max. |
2.0MIL |
| 11. |
electronic
plating Ni-Au (Flash Glod) |
|
nickel
thickness |
|
min.
-- max.
|
50 - 250
u"(microinch) |
| gold
thickness |
|
| min.
-- max.
|
2 - 8
u" |
|
12.
|
electroless
NI-Au (Gold Immersion)
|
|
nickel
thickness |
|
min.
-- max.
|
50 - 300
u"(microinch) |
| gold
thickness |
|
| min.
-- max.
|
1 - 5
u" |
|